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Sizzix

Sizzix DIE BRUSH AND FOAM PAD For Wafer Thin Dies 660513

660513
$9.99
When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
The Die Brush measures approximately 5.5 x 1.75 x 1.25 inches and the Foam Pad measures approximately 4.5 x 7.25 inches. Replacement Brush Heads and Foam Pads are sold separately.

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Since 1977, Ellison the parent company of Sizzix has been the global leader in empowering the individual to express their personal creativity through a premier suite of innovative products. The company is committed to celebrating style and leading creative expression for generations to come. Sizzix puts creativity in your hands with the craftiest die-cutting and embossing possibilities!  The Start of Something You!
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